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DATA SHEET
MOS INTEGRATED CIRCUIT
PD23C128000BL
128M-BIT MASK-PROGRAMMABLE ROM 16M-WORD BY 8-BIT (BYTE MODE) / 8M-WORD BY 16-BIT (WORD MODE)
Description
The PD23C128000BL is a 134,217,728 bits mask-programmable ROM. The word organization is selectable
(BYTE mode : 16,777,216 words by 8 bits, WORD mode : 8,388,608 words by 16 bits). With 44-pin PLASTIC SOP package products, only word mode can be used; it is not possible to switch to byte mode. The active levels of OE (Output Enable Input) can be selected with mask-option. The PD23C128000BL is packed in 48-pin PLASTIC TSOP (I) and 44-pin PLASTIC SOP.
Features
* Word organization 16,777,216 words by 8 bits (BYTE mode)
Note Note
8,388,608 words by 16 bits (WORD mode)
Note With 44-pin PLASTIC SOP package products, only word mode can be used. It is not possible to switch to byte mode. * Operating supply voltage : VCC = 2.7 to 3.6 V
Operating supply voltage VCC 3.0 V 0.3 V 3.3 V 0.3 V Access time ns (MAX.) 120 100 Power supply current (Active mode) mA (MAX.) 50 55 Standby current (CMOS level input)
A (MAX.)
30
Ordering Information
Part Number Package 48-pin PLASTIC TSOP(I) (12x18) (Normal bent) 48-pin PLASTIC TSOP(I) (12x18) (Reverse bent) 44-pin PLASTIC SOP (15.24 mm (600))
PD23C128000BLGY-xxx-MJH PD23C128000BLGY-xxx-MKH PD23C128000BLGX-xxx
(xxx : ROM code suffix No.)
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information.
Document No. M15900EJ3V0DS00 (3rd edition) Date Published February 2003 NS CP (K) Printed in Japan
The mark shows major revised points.
2002
PD23C128000BL
Pin Configurations
/xxx indicates active low signal. 48-pin PLASTIC TSOP (I) (12x18) (Normal bent) [ PD23C128000BLGY-xxx-MJH ]
Marking Side
WORD, /BYTE A16 A15 A14 A13 A12 A11 A10 A9 A8 A19 A21 A20 A18 A17 A7 A6 A5 A4 A3 A2 A1 A0 /CE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 GND GND O15, A-1 O7 O14 O6 O13 O5 O12 O4 VCC VCC A22 O11 O3 O10 O2 O9 O1 O8 O0 /OE or OE or DC GND GND
A0 to A22 O15, A-1 WORD, /BYTE /CE /OE or OE VCC GND DC
: Address inputs : Data output 15 (WORD mode), LSB Address input (BYTE mode) : Mode select input : Chip Enable input : Output Enable input : Supply voltage : Ground : Don't Care
O0 to O7, O8 to O14 : Data outputs
Remark Refer to Package Drawings for the 1-pin index mark.
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Data Sheet M15900EJ3V0DS
PD23C128000BL
48-pin PLASTIC TSOP (I) (12x18) (Reverse bent) [ PD23C128000BLGY-xxx-MKH ]
Marking Side
GND GND O15, A-1 O7 O14 O6 O13 O5 O12 O4 VCC VCC A22 O11 O3 O10 O2 O9 O1 O8 O0 /OE or OE or DC GND GND 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 WORD, /BYTE A16 A15 A14 A13 A12 A11 A10 A9 A8 A19 A21 A20 A18 A17 A7 A6 A5 A4 A3 A2 A1 A0 /CE
A0 to A22 O15, A-1 WORD, /BYTE /CE /OE or OE VCC GND DC
: Address inputs : Data output 15 (WORD mode), LSB Address input (BYTE mode) : Mode select input : Chip Enable input : Output Enable input : Supply voltage : Ground : Don't Care
O0 to O7, O8 to O14 : Data outputs
Remark Refer to Package Drawings for the 1-pin index mark.
Data Sheet M15900EJ3V0DS
3
PD23C128000BL
44-pin PLASTIC SOP (15.24 mm (600)) [ PD23C128000BLGX-xxx ]
Marking Side
A21 A18 A17 A7 A6 A5 A4 A3 A2 A1 A0 /CE GND /OE or OE or DC O0 O8 O1 O9 O2 O10 O3 O11
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22
44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23
A20 A19 A8 A9 A10 A11 A12 A13 A14 A15 A16 A22 GND O15 O7 O14 O6 O13 O5 O12 O4 VCC
A0 to A22 O0 to O15 /CE /OE or OE VCC GND DC
: : : : : : :
Address inputs Data outputs Chip Enable Output Enable Supply voltage Ground Don't Care
Remarks 1. Refer to Package Drawings for the 1-pin index mark. 2. With 44-pin PLASTIC SOP package products, only word mode (8,388,608 words x 16 bits) can be used. There is no mode select (WORD, /BYTE) pin.
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Data Sheet M15900EJ3V0DS
PD23C128000BL
Input / Output Pin Functions
Pin name WORD, /BYTE Input / Output Input Function The pin for switching WORD mode and BYTE mode. High level : WORD mode (8M-word by 16-bit) Low level : BYTE mode (16M-word by 8-bit) A0 to A22 (Address inputs) Input Address input pins. A0 to A22 are used differently in the WORD mode and the BYTE mode. WORD mode (8M-word by 16-bit) A0 to A22 are used as 23 bits address signals. BYTE mode (16M-word by 8-bit) A0 to A22 are used as the upper 23 bits of total 24 bits of address signal. (The least significant bit (A-1) is combined to O15.) O0 to O7, O8 to O14 (Data outputs) Output Data output pins. O0 to O7, O8 to O14 are used differently in the WORD mode and the BYTE mode. WORD mode (8M-word by 16-bit) The lower 15 bits of 16 bits data outputs to O0 to O14. (The most significant bit (O15) combined to A-1.) BYTE mode (16M-word by 8-bit) 8 bits data outputs to O0 to O7 and also O8 to O14 are high impedance. O15, A-1 (Data output 15, LSB Address input) Output, Input O15, A-1 are used differently in the WORD mode and the BYTE mode. WORD mode (8M-word by 16-bit) The most significant output data bus (O15). BYTE mode (16M-word by 8-bit) The least significant address bus (A-1). /CE (Chip Enable) Input Chip activating signal. When the OE is active, output states are following. High level : High-Z Low level : Data out /OE or OE or DC (Output Enable, Don't Care) VCC GND - - Input Output enable signal. The active level of OE is mask option. The active level of OE can be selected from high active, low active and Don't care at order. Supply voltage Ground
Data Sheet M15900EJ3V0DS
5
PD23C128000BL
Block Diagram
O8 O0 O1 O9 O2 O10 O11 O3 O12 O4 O5 O13 O6 O14 O15, A-1
O7
A0 A1 A2 A3 A4 A5 A6 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21 A22
Address Input Buffer Y-Decoder
Output Buffer
Logic/Input
WORD, /BYTE /OE or OE or DC
Y-Selector
A7
Memory Cell Matrix
X-Decoder Input Buffer
8,388,608 words by 16 bits / 16,777,216 words by 8 bits
/CE
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Data Sheet M15900EJ3V0DS
PD23C128000BL
Mask Option The active levels of output enable pin (/OE or OE or DC) are mask programmable and optional, and can be selected from among " 0 " " 1 " " x " shown in the table below.
Option 0 1 x /OE or OE or DC /OE OE DC OE active level L H Don't care
Operation modes for each option are shown in the tables below. Operation mode (Option : 0)
/CE L /OE L H H H or L Standby Mode Active Output state Data out High-Z High-Z
Operation mode (Option : 1)
/CE L OE L H H H or L Standby Mode Active Output state High-Z Data out High-Z
Operation mode (Option : x)
/CE L H DC H or L H or L Mode Active Standby Output state Data out High-Z
Remark L : Low level input H : High level input
Data Sheet M15900EJ3V0DS
7
PD23C128000BL
Electrical Specifications
Absolute Maximum Ratings
Parameter Supply voltage Input voltage Output voltage Operating ambient temperature Storage temperature Symbol VCC VI VO TA Tstg Condition Rating -0.3 to +4.6 -0.3 to VCC+0.3 -0.3 to VCC+0.3 -10 to +70 -65 to +150 Unit V V V C C
Caution Exposing the device to stress above those listed in Absolute Maximum Ratings could cause permanent damage. The device is not meant to be operated under conditions outside the limits described in the operational section of this specification. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Capacitance (TA = 25 C)
Parameter Input capacitance Output capacitance Symbol CI CO f = 1 MHz Test condition MIN. TYP. MAX. 10 12 Unit pF pF
DC Characteristics (TA = -10 to +70 C, VCC = 2.7 to 3.6 V)
Parameter High level input voltage Low level input voltage Symbol VIH VIL VCC = 3.0 V 0.3 V VCC = 3.3 V 0.3 V High level output voltage Low level output voltage Input leakage current Output leakage current Power supply current VOH VOL ILI ILO ICC1 IOH = -100 A IOL = 2.1 mA VI = 0 V to VCC VO = 0 V to VCC, Chip deselected /CE = VIL (Active mode), VCC = 3.0 V 0.3 V IO = 0 mA Standby current ICC3 VCC = 3.3 V 0.3 V -10 -10 Test conditions MIN. 2.0 -0.3 -0.3 2.4 0.4 +10 +10 50 55 30 TYP. MAX. VCC + 0.3 +0.5 +0.8 V V Unit V V
A A
mA
/CE = VCC - 0.2 V (Standby mode)
A
8
Data Sheet M15900EJ3V0DS
PD23C128000BL
AC Characteristics (TA = -10 to +70 C, VCC = 2.7 to 3.6 V)
Parameter Symbol Test condition VCC = 3.0 V 0.3 V MIN Address access time Address skew time Chip enable access time Output enable access time Output hold time Output disable time WORD, /BYTE access time tACC tSKEW tCE tOE tOH tDF tWB 0 0 20 120 Note TYP. MAX. 120 10 120 25 0 0 20 100 VCC = 3.3 V 0.3 V MIN TYP. MAX. 100 10 100 25 ns ns ns ns ns ns ns Unit
Note tSKEW indicates the following three types of time depending on the condition. 1) When switching /CE from high level to low level, tSKEW is the time from the /CE low level input point until the next address is determined. 2) When switching /CE from low level to high level, tSKEW is the time from the address change start point to the /CE high level input point. 3) When /CE is fixed to low level, tSKEW is the time from the address change start point until the next address is determined. Since specs are defined for tSKEW only when /CE is active, tSKEW is not subject to limitations when /CE is switched from high level to low level following address determination, or when the address is changed after /CE is switched from low level to high level. Remark tDF is the time from inactivation of Chip Enable input (/CE) or Output Enable input (/OE or OE) to high impedance state output. AC Test Conditions Input waveform (Rise / Fall Time 5 ns)
1.4 V
Test points
1.4 V
Output waveform
1.4 V
Test points
1.4 V
Output load 1TTL + 100 pF
Data Sheet M15900EJ3V0DS
9
PD23C128000BL
Cautions on power application To ensure normal operation, always apply power using /CE following the procedure shown below. 1) Input a high level to /CE during and after power application. 2) Hold the high level input to /CE for 200 ns or longer (wait time). 3) Start normal operation after the wait time has elapsed. Power Application Timing Chart 1 (When /CE is made high at power application)
Wait time /CE (Input) 200 ns or longer Normal operation
VCC
Power Application Timing Chart 2 (When /CE is made high after power application)
Wait time /CE (Input) 200 ns or longer Normal operation
VCC
Caution Other signals can be either high or low during the wait time.
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Data Sheet M15900EJ3V0DS
PD23C128000BL
Read Cycle Timing Chart
tSKEW A0 to A22, (Input) A-1 Note1 tACC tACC
tSKEW
tSKEW
tACC
/CE (Input) tCE tDF Note2 tDF Note2
/OE or OE (Input) tOE O0 to O7, (Input) O8 to O15 Note3 High-Z tOH High-Z tOH tOH
Data out
Data out
Data out
Notes 1. During WORD mode, A-1 is O15. 2. tDF is the time from inactivation of Chip Enable input (/CE) or Output Enable input (/OE or OE) to high impedance state output. 3. During BYTE mode, O8 to O14 are high impedance and O15 is A-1. WORD, /BYTE Switch Timing Chart
A-1 (Input)
High-Z
High-Z
WORD, /BYTE (Input) tOH tACC tOH tWB
O0 to O7 (Output)
Data Out
Data Out
Data Out
tDF High-Z
O8 to O15 (Output)
Data Out
Data Out
Remark Chip Enable (/CE) and Output Enable (/OE or OE) : Active.
Data Sheet M15900EJ3V0DS
11
PD23C128000BL
Package Drawings
48-PIN PLASTIC TSOP(I) (12x18)
1 48 F G R detail of lead end
Q 24 25 E P I J A
L S
S D K N S
C MM
B
NOTES
1. Each lead centerline is located within 0.10 mm of its true position (T.P.) at maximum material condition. 2. "A" excludes mold flash. (Includes mold flash : 12.4 mm MAX.)
ITEM A B C D E F G I J K L M N P Q R S
MILLIMETERS 12.00.1 0.45 MAX. 0.5 (T.P.) 0.220.05 0.10.05 1.2 MAX. 1.00.05 16.40.1 0.80.2 0.1450.05 0.5 0.10 0.10 18.00.2 3 +5 -3 0.25 0.600.15 S48GY-50-MJH1-1
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Data Sheet M15900EJ3V0DS
PD23C128000BL
48-PIN PLASTIC TSOP(I) (12x18)
detail of lead end 1 48 E S Q L
R G F
24
25
K
N
S S
D C
MM B
I P
J
A
NOTES
1. Each lead centerline is located within 0.10 mm of its true position (T.P.) at maximum material condition. 2. "A" excludes mold flash. (Includes mold flash : 12.4 mm MAX.)
ITEM A B C D E F G I J K L M N P Q R S
MILLIMETERS 12.00.1 0.45 MAX. 0.5 (T.P.) 0.220.05 0.10.05 1.2 MAX. 1.00.05 16.40.1 0.80.2 0.1450.05 0.5 0.10 0.10 18.00.2 3 +5 -3 0.25 0.600.15 S48GY-50-MKH1-1
Data Sheet M15900EJ3V0DS
13
PD23C128000BL
44-PIN PLASTIC SOP (15.24 mm (600))
44
23
detail of lead end
P 1 A H F G S I J 22
C D E M
M
N
S
B K
L
NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition.
ITEM A B C D E F G H I J K L M N P
MILLIMETERS 27.83+0.4 -0.05 0.78 MAX. 1.27 (T.P.) 0.42 +0.08 -0.07 0.150.1 3.0 MAX. 2.70.05 16.040.3 13.240.1 1.40.2 0.22 +0.08 -0.07 0.80.2 0.12 0.10 3 +7 -3 P44GX-50-600A-4
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Data Sheet M15900EJ3V0DS
PD23C128000BL
Recommended Soldering Conditions
Please consult with our sales offices for soldering conditions of the PD23C128000BL. Types of Surface Mount Device
PD23C128000BLGY-xxx-MJH PD23C128000BLGX-xxx
: 48-pin PLASTIC TSOP(I) (12x18) (Normal bent) : 44-pin PLASTIC SOP (15.24 mm (600))
PD23C128000BLGY-xxx-MKH : 48-pin PLASTIC TSOP(I) (12x18) (Reverse bent)
Data Sheet M15900EJ3V0DS
15
PD23C128000BL
Revision History
Edition/ Date This edition 3rd edition/ Feb. 2003 p.10 p.11 - p.10 Addition Modification p.9 Page Previous edition p.9 Addition AC Characteristics Address skew time (tSKEW) Note Cautions on power application Read Cycle Timing Chart Type of revision Location Description (Previous edition This edition)
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Data Sheet M15900EJ3V0DS
PD23C128000BL
[MEMO]
Data Sheet M15900EJ3V0DS
17
PD23C128000BL
[MEMO]
18
Data Sheet M15900EJ3V0DS
PD23C128000BL
NOTES FOR CMOS DEVICES
1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS Note: Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. Environmental control must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators that easily build static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work bench and floor should be grounded. The operator should be grounded using wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with semiconductor devices on it. 2 HANDLING OF THE APPLIED WAVEFORM OF INPUT PINS AND THE UNUSED INPUT PINS FOR CMOS Note: Input levels of CMOS devices must be fixed. CMOS devices behave differently than Bipolar or NMOS devices. If the input of a CMOS device stays in an area that is between VIL (MAX.) and VIH (MIN.) due to the effects of noise or some other irregularity, malfunction may result. Therefore, not only the input waveform is fixed, but also the waveform changes, it is important to use the CMOS device under AC test conditions. For unused input pins in particular, CMOS devices should not be operated in a state where nothing is connected, so input levels of CMOS devices must be fixed to high or low by using pull-up or pull-down circuitry. Each unused pin should be connected to VDD or GND with a resistor, if it is considered to have a possibility of being an output pin. All handling related to the unused pins must be judged device by device and related specifications governing the devices. 3 STATUS BEFORE INITIALIZATION OF MOS DEVICES Note: Power-on does not necessarily define initial status of MOS device. Production process of MOS does not define the initial operation status of the device. Immediately after the power source is turned ON, the devices with reset function have not yet been initialized. Hence, power-on does not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the reset signal is received. Reset operation must be executed immediately after power-on for devices having reset function.
Data Sheet M15900EJ3V0DS
19
PD23C128000BL
These commodities, technology or software, must be exported in accordance with the export administration regulations of the exporting country. Diversion contrary to the law of that country is prohibited.
* The information in this document is current as of February, 2003. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. * NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. * NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above).
M8E 02. 11-1

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